Finish |
Description |
HASL (Hot Air
Solder Leveled) |
Solder is deposited on features that are
not covered with Solder Mask. Solder Thickness varies from 0.2
to 1.2 mils. This variation is due to board circuit density,
aspect ratio. Solder consists of 63%/37% eutectic Tin/lead |
| OSP (Organic Solder ability Preservative)
|
A transparent organic coating is deposited
on features that are not covered with solder mask. |
| ENIG (Electrolyses Nickel/Gold) |
Electrolyses nickel and Electrolyses gold
is deposited on features that are not covered with Solder Mask.
Thickness for Nickel is between 80 to 150 micro inches and Gold
thickness is 3-6 micro inches. |
| Gold Flash |
Electrolytic nickel-gold deposited on solder
able features. Typically 150-200 micro inches of nickel is deposited,
and 5-10 micro inches of Hard gold. Gold flash is applied to
features after pattern Copper plating. |
| Immersion Silver |
Silver is deposited on features not covered
with solder mask. Thickness of silver is 4 to 20 micro inches.
|
| White Tin |
Immersion tin is deposited on features not
covered with Solder mask. Thickness is typically 30-40 micro
inches. |
Carbon Ink for
Key pad application |
A conductive carbon paste is applied on selective
pads for contact purposes, e.g.. Keypads of calculators, etc.
|
Wire Bondable
Soft Gold |
Electrolytic soft gold is plated on features
that require bondable gold for wire bonding application. Depending
on the type of wire bonding used, the thickness of gold varies
from 20 to 50 micro inches. Nickel thickness is between 150
to 250 micro inches. |
