Technologies |
Standard |
Advanced |
Minimum
Line/Spacing, Internal |
3/3 |
3/3 |
Minimum Line/Spacing, External
|
4/4 |
3/3 |
Minimum
Drilled Hole Size |
8 |
6 |
Aspect Ratio
(Thickness to Drill) |
10:1 |
15:1 |
Anular Ring
(Diameter over Drill) |
10 |
8 |
Anti-pad
(Diameter over Drill) |
20 |
16 |
Plated Hole
Tolerance |
±3 |
±2 |
Minimum
Dielectric Thickness |
3 |
2 |
Maximum
PCB Thickness (inches) |
0.200 |
0.250 |
Thickness
Tolerance (% of Thickness) |
±10 |
±7 |
Maximum
PCB Dimensions (inches) |
16.0 X 22.0 |
23.0 X 26.0 |
Fabricated
Dimensions - NC Routing |
±5 mils |
±3 mils |
Layer-to-Layer
Registration Tolerance |
±5 |
±3 |
Solder Mask
Clearance, Per Side |
2.0 mils |
1.5 mils |
Blind/Buried
Vias (All Types) |
yes |
yes |
| Via Fill
(Conductive, Non-Conductive) |
no |
yes |
